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Israeli company Nano Dimension has demonstrated the ability to install components during the 3D printing process of electronic circuits.
Since 2012, Nano Dimension has been developing a methodology for rapid prototyping of boards using conductive and insulating inks. Initially, the technology was focused on the creation of multilayer boards, but recent company experiences have shown the possibility of creating circuits with the installation of electronic components directly during printing.
The new approach opens up a number of interesting possibilities. Firstly, the reliability of the circuits is increased, since the protective finish can be applied not only to the tracks, but also to electronic components. Secondly, the practical ability to print circuits and install parts on thin substrates has been proven, which allows to reduce the dimensions of the boards and create flexible electronics. The most obvious advantage is the elimination of the need for soldering, because the necessary components are initially "imprinted" in the board.
The company has filed a patent application and intends to make the new process standard for Dragonfly 2020 branded 3D printers.
